Revasum, Inc.

Equities

RVS

AU0000030959

Semiconductor Equipment & Testing

Delayed Australian S.E. Other stock markets 11:34:39 2024-01-31 pm EST			5-day change	1st Jan Change
0.115 ^AUD	-11.54%		-.--%	-17.86%

Mar. 05	Revasum Receives Multiple Buyout Offers; Renegotiating Debt Repayment	MT
Jan. 15	Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding	CI

Revasum, Inc. Reports Earnings Results for the Half Year Ended July 02, 2023

September 31, 2023 at 09:17 pm EDT

Revasum, Inc. reported earnings results for the half year ended July 02, 2023. For the half year, the company reported sales was USD 9.54 million compared to USD 7.41 million a year ago. Net loss was USD 3.64 million compared to USD 5.32 million a year ago.

Basic loss per share from continuing operations was USD 0.03 compared to USD 0.05 a year ago.

Latest news about Revasum, Inc.

Revasum Receives Multiple Buyout Offers; Renegotiating Debt Repayment	Mar. 05	MT
Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding	Jan. 15	CI
Revasum Raises AU$1.2 Million from CDI Issue	Dec. 20	MT
Revasum Dispatches Acceptance Forms for Entitlement Offer	Dec. 07	MT
Revasum Raising Up to AU$6.3 Million for Working Capital Needs	Nov. 28	MT
Revasum, Inc. Announces Resignation of Ryan Benton as Non-Executive Director	23-10-31	CI
Revasum, Inc. Announces Revenue Guidance for the Fiscal Year 2023	23-10-16	CI
Revasum Secures Additional Financing to Spend Toward Working Capital; Shares Jump 4%	23-09-11	MT
Revasum, Inc. Reports Earnings Results for the Half Year Ended July 02, 2023	23-08-31	CI
Revasum, Inc. Provides Revenue Guidance for the Third Quarter of Fiscal Year 2023	23-08-28	CI
Revasum Announces the Release of a 200mm Conversion Kit for Their 6EZ Silicon Carbide Chemical Mechanical Polishing Platform	23-07-05	CI
Transcript : Revasum, Inc. - Shareholder/Analyst Call	23-05-25
Revasum Secures AU$12 Million New, Revised Funding Package	23-04-13	MT
Revasum Sells Second 7AF-HMG Grinder to US Manufacturer	23-03-31	MT
Halo Industries, Inc acquired 7AFHMG Grinder from Revasum, Inc.	23-03-30	CI
Revasum Secures AU$250,000 of Additional Funding from Major Shareholder	23-03-23	MT
Revasum, Inc. Reports Earnings Results for the Full Year Ended January 02, 2023	23-03-01	CI
Revasum, Inc. Auditor Raises 'Going Concern' Doubt	23-02-28	CI
Revasum Signs Term Sheet for Up to AU$3 Million Investment	23-02-08	MT
Revasum Secures $750,000 Additional Working Capital; Shares Jump 23%	22-11-15	MT
Revasum, Inc. announced that it expects to receive $0.75 million in funding	22-11-13	CI
Revasum Provides Revenue Guidance for the Full Year of Fiscal 2022	22-10-19	CI
Revasum, Inc. Announces Board Changes	22-10-02	CI
Revasum Appoints CFO; Shares Slip 3%	22-09-12	MT
Revasum Appoints Bruce G. Ray as Chief Financial Officer	22-09-12	CI

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Company Profile

Revasum, Inc. designs, manufactures, and markets a portfolio of semiconductor processing equipment (also known as systems). The systems that the Company manufactures are an integral part of the production chain in manufacturing and processing wafers sized 200mm and below. These wafers are used to make microchips, sensors, light-emitting diode (LED)s, radiofrequency (RF) devices and power devices, used in connected Internet of things (IoT) devices, mobile phones, wearables, automotive, 5G and industrial applications. Its product portfolio includes grinding, polishing and chemical-mechanical planarization (CMP) equipment used to manufacture substrates and devices for the global semiconductor industry. Its equipment solutions include 6EZ Polisher, 7AF-HMG Grinder, and Re-Manufactured Equipment. 6EZ Polisher is an automated, single wafer, dry-in-dry-out polisher designed specifically for silicon carbide (SiC). The Company operates in United States, China, Europe, Japan, Korea and Taiwan.

Sector

Semiconductor Equipment & Testing

Calendar

2024-08-20 - Q2 2024 Earnings Release (Projected)

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Sector Semiconductor Machinery Manufacturing

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Semiconductor Machinery Manufacturing