Revasum, Inc.

Equities

RVS

AU0000030959

Semiconductor Equipment & Testing

Market Closed - Australian S.E. 11:34:39 2024-01-31 pm EST 5-day change 1st Jan Change
0.115 AUD -11.54% Intraday chart for Revasum, Inc. -.--% -17.86%

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Revasum Receives Multiple Buyout Offers; Renegotiating Debt Repayment MT
Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding CI
Revasum Raises AU$1.2 Million from CDI Issue MT
Revasum Dispatches Acceptance Forms for Entitlement Offer MT
Revasum Raising Up to AU$6.3 Million for Working Capital Needs MT
Revasum, Inc. Announces Resignation of Ryan Benton as Non-Executive Director CI
Revasum, Inc. Announces Revenue Guidance for the Fiscal Year 2023 CI
Revasum Secures Additional Financing to Spend Toward Working Capital; Shares Jump 4% MT
Revasum, Inc. Reports Earnings Results for the Half Year Ended July 02, 2023 CI
Revasum, Inc. Provides Revenue Guidance for the Third Quarter of Fiscal Year 2023 CI
Revasum Announces the Release of a 200mm Conversion Kit for Their 6EZ Silicon Carbide Chemical Mechanical Polishing Platform CI
Transcript : Revasum, Inc. - Shareholder/Analyst Call
Revasum Secures AU$12 Million New, Revised Funding Package MT
Revasum Sells Second 7AF-HMG Grinder to US Manufacturer MT
Halo Industries, Inc acquired 7AFHMG Grinder from Revasum, Inc. CI
Revasum Secures AU$250,000 of Additional Funding from Major Shareholder MT
Revasum, Inc. Reports Earnings Results for the Full Year Ended January 02, 2023 CI
Revasum, Inc. Auditor Raises 'Going Concern' Doubt CI
Revasum Signs Term Sheet for Up to AU$3 Million Investment MT
Revasum Secures $750,000 Additional Working Capital; Shares Jump 23% MT
Revasum, Inc. announced that it expects to receive $0.75 million in funding CI
Revasum Provides Revenue Guidance for the Full Year of Fiscal 2022 CI
Revasum, Inc. Announces Board Changes CI
Revasum Appoints CFO; Shares Slip 3% MT
Revasum Appoints Bruce G. Ray as Chief Financial Officer CI
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Revasum, Inc. designs, manufactures, and markets a portfolio of semiconductor processing equipment (also known as systems). The systems that the Company manufactures are an integral part of the production chain in manufacturing and processing wafers sized 200mm and below. These wafers are used to make microchips, sensors, light-emitting diode (LED)s, radiofrequency (RF) devices and power devices, used in connected Internet of things (IoT) devices, mobile phones, wearables, automotive, 5G and industrial applications. Its product portfolio includes grinding, polishing and chemical-mechanical planarization (CMP) equipment used to manufacture substrates and devices for the global semiconductor industry. Its equipment solutions include 6EZ Polisher, 7AF-HMG Grinder, and Re-Manufactured Equipment. 6EZ Polisher is an automated, single wafer, dry-in-dry-out polisher designed specifically for silicon carbide (SiC). The Company operates in United States, China, Europe, Japan, Korea and Taiwan.
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