On May 11, 2023, Hindustan Copper Limited (BSE:513599) informed that it plans to raise around INR 5.48 billion through various routes including Qualified Institutional Placement (QIP) and issuance of bonds. A proposal regarding this will be taken up at the company's board meeting on May 19, 2023. In an exchange filing, the company said that its board will consider recommendation for seeking approval of shareholders to raise funds by issue of equity shares through Qualified Institutional Placement method to the extent of 96,976,680 equity shares of face value of INR 5 each in one or more tranches.

It will also consider to offer, issue and allot secured or unsecured non-convertible debentures or bonds on private placement basis up to INR 5.00 billion.