Axcelis Technologies, Inc. announced that it will showcase its Purion(TM) and GSD Ovation(TM) Series of ion implanters at the SEMICON Japan 2023 exhibition. The conference and exhibition is being held December 13-15, at the Tokyo Big Sight in Tokyo, Japan. Axcelis will be located in East Hall 5, Booth #5821.

Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages. Purion Power Series(TM) - Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space. Purion H(TM) Series - Including the new Purion H5(TM) and the Purion Dragon(TM), both designed to provide a comprehensive solution for high current implants.

Purion H200(TM) - Axcelis' single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications. Purion XEmax(TM), includes the new Purion XEmax (TM), designed for the most advanced image sensor applications up to 15MeV. Purion M(TM) Series - Offering the broadest spectrum of mid-current doses available, enabling unparalleled flexibility to meet today's evolving implant requirements.

GSD Ovation(TM), Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic).