Renesas Electronics Corporation announced a new organizational structure and leadership team appointments. These changes will take effect January 1, 2024, and will support the company in its next phase of growth and development to become the leader in embedded semiconductor solutions. Renesas is establishing a technology-based organization designed to provide more comprehensive and tailored solution offerings.

As part of these changes, Renesas? businesses will be restructured into four new product groups. Analog & Connectivity: Davin Lee, currently Vice President of Advanced Analog Division, will assume the role of Senior Vice President and General Manager of Analog & Connectivity.

Under Davin?s leadership, the group will be responsible for analog products as well as the company?s vast portfolio of connectivity products. Embedded Processing: Toshihiko Seki, currently Vice President of MCU Device Solution Division, will assume the role of Senior Vice President and General Manager of Embedded Processing. He will be responsible for Renesas?

entire standard catalog embedded processing products. The group is designed to accelerate the company?s efforts to provide more catalog products and solutions to go deeper and broader with new and existing customers. High Performance Computing: Vivek Bhan, who currently holds the position of Senior Vice President and Co-General Manager of High Performance Computing, Analog and Power Solutions Group, will assume the role of Senior Vice President and General Manager of High Performance Computing.

He will be responsible for the company?s custom and application-specific high computing products. Power: Chris Allexandre who currently serves as Senior Vice President, Chief Sales & Marketing Officer and Head of the Global Sales and Marketing Unit will take on a new role as Senior Vice President and General Manager of Power. Chris will be responsible for overseeing Renesas?

power management and discrete products and executing the company?s power strategies. Engineering: Renesas is creating a centralized engineering organization to solidify Renesas? engineering foundation, from product to test engineering.

This new organization will direct the development and execution of the company?s technology and product roadmaps. Takeshi Kataoka, Senior Vice President and Co-General Manager of High Performance Computing, Analog and Power Solutions Group, will newly head this Engineering organization. Quality Assurance: Takeshi Kataoka will also oversee the Quality Assurance function as Senior Vice President and Head of Engineering and Quality Assurance.

His experience and profound expertise in leading Renesas? automotive semiconductor business will help the company to continue to assure supreme quality levels throughout its products and solutions. Sales & Marketing: Bobby Matinpour, who currently serves as Vice President of Global Strategic Vertical & Regional Sales, will succeed Chris Allexandre in the role of Senior Vice President, CSMO and Head of Sales & Marketing.

These leaders in addition to leaders of each of four product groups will report directly to the CEO. This will allow them to have greater influence on Renesas? strategy and execution, while enhancing accountability.

Hiroto Nitta will retire from his role of Senior Vice President of Information Technology. In addition to his current role, Nitta served multiple managerial positions at Renesas including Vice President and Deputy General Manager of Global Sales Units as well as Senior Vice President and Deputy General Manager of Broad-Based Solution Business Unit. He also served as Senior Vice President and Head of SoC Business in the IoT and Infrastructure Business.

As a result of the organizational changes, Roger Wendelken, who has been serving as Senior Vice President and Head of Embedded Microcontroller in the Embedded Processing, Digital Power and Signal Chain Solutions Group will leave Renesas. Roger joined Renesas in 2017 following the Intersil acquisition. He contributed to Renesas as leader of worldwide sales for the broad-based solution business.

In his current position, Roger played an instrumental role in releasing the ARM-based RA microcontrollers. Andrew Cowell will retire from his role of Senior Vice President and Head of Performance Power. Since joining Renesas in 2017 from Intersil, Andrew guided the foundation in strengthening the growth and market share gains of the digital multiphase controllers and smart power stages for the infra core power businesses.

Davin Lee: He serves as the Vice President and General Manager of the Advanced Analog Division at Renesas Electronics Corporation. He joined Renesas in August 2021 through the acquisition of Dialog Semiconductor PLC where he was the Senior Vice President of the Advanced Mixed-Signal Business. Prior to Dialog Semiconductor, he held executive-level management positions at numerous semiconductor companies including Scintera Networks (CEO), Intersil (VP/GM of Power Management), Xicor (VP of Marketing), Altera and National Semiconductor.

Davin Lee holds a BSEE degree from the University of Texas at Austin and an MBA degree from Kellogg School of Management at Northwestern University.Toshihiko Seki: He serves as the Vice President of MCU Device Solution Business Division at Renesas Electronics Corporation since January 2022. In this role, he is mainly responsible for leading the company?s proprietary RL78 microcontroller business and has been instrumental in achieving global leading market share position for the 16-bit MCU architecture category. He has more than 30 years of experience in the semiconductors industry.

He started his career in ASIC/memory product marketing at Hitachi Ltd., and heldvariousmarketing management positions at Renesas, including Director of Marketing & Business operations at Renesas Electronics America. He holds a bachelor?s degree in Liberal Arts from Sophia University, Japan. Bobby Matinpour: He serves as the Vice President of Global Strategic Vertical & Regional Sales at Renesas Electronics Corporation since April 2022.

Previously at Renesas, he was the Vice President of Timing and Standard Product Business Division since March 2019. Prior to joining Renesas, he served as the Vice President of the High Speed Data & Clock Business Unit at Texas Instruments. A 20-year veteran of the semiconductor industry, he has a diverse and wholistic industry experience covering engineering, product marketing, operations, and sales management for a wide-range of products and solutions addressing industrial, infrastructure, consumer, and automotive markets.

Prior to joining Texas Instruments, he held various engineering and marketing management positions at National Semiconductor, Epson-Toyocom, and several semiconductor startups. He holds a BSEE from Virginia Tech and MS and PhD EE from Georgia Institute of Technology.