General Announcement::Presentation materials for FY21 results briefing on 31 August 2021
August 31, 2021 at 10:02 am EDT
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FY2021 Results Presentation
31 August 2021
perfect parts and tools, on time, every time
Business & Industry
Chris Borch, CEO
Low Ming Wah, COO
Micro-Mechanics FY2021 Results Presentation
2
Corporate Overview
Founded in 1983 in Singapore
Design and manufacture high precision tools and parts used in process-critical applications for the wafer-fabricationand assembly processes of the semiconductor industry
Serve a worldwide base of customers from five facilities in Asia (Singapore, Malaysia, China, Philippines) and the USA
More than 600 active customers
Listed on the Singapore Exchange (Main Board) since 2003
Committed to generating shareholder returns
Our Mission is…
Perfect Parts and Tools On
Time, Every Time
Based on Scalable, Repeatable and Cost-
Effective Processes
Micro-Mechanics FY2021 Results Presentation
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Business Model
HIGH PRECISION, PROCESS-CRITICAL
Parts and Tools for Semiconductor Industry
BUSINESS
PRODUCTS
FRONT END
Wafer fabrication
Contract manufacturing of process- critical wafer fabrication equipment parts
Engineering of high precision parts that have a critical impact on wafer processing, for various front-end equipment
BACK END
Assembly & Test (A&T)
Proprietary consumable tools used in the semiconductor A&T processes
Engineering of high precision process- critical tools such as die-attach and wirebonding tools.
Ultra fine tools with tips, hole sizes or features from as small as 0.05mm and 0.10mm
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Micro-Mechanics (Holdings) Ltd. published this content on 31 August 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 31 August 2021 14:01:05 UTC.
Micro-Mechanics (Holdings) Ltd. is a Singapore-based integrated mechanics solution company. The Company is engaged in the business of designing, manufacturing, and marketing high precision tools and parts used in process-critical applications for the wafer-fabrication and assembly processes of the semiconductor industry. The Company is also engaged in the contract manufacturing of precision parts and tools used in process-critical applications for the semiconductor wafer-fabrication industry. The Company's segments include Singapore, Malaysia, the Philippines, the USA, and China. Its products and solutions include Semiconductor, which include Die Attach, Wire-bonding, and Encapsulation. Its Die Attach products include Rubber Tips (Integrated Circuits), High-Temp Plastic Tools, Tungsten Carbide Collets, Sensor Assembly (ASM), Vacuum Wand Tools, Dispensing Nozzle Adaptors, Epoxy Stamping Tools, Die Ejection, Wire Bonding, and Encapsulation, among others.