Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
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5-day change | 1st Jan Change | ||
16.1 HKD | +1.13% | +12.75% | -14.72% |
Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
1st Jan change | Capi. | |
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-14.72% | 4.38B | |
+73.28% | 2,112B | |
+33.22% | 617B | |
+10.93% | 574B | |
-0.85% | 236B | |
+3.13% | 160B | |
-39.27% | 130B | |
+31.67% | 124B | |
+30.41% | 101B | |
-1.04% | 97.44B |