Shenzhen Relpow Hybrid Integrated Circuit Co., Ltd. announced that it will receive CNY 95 million in equity round of funding on October 26, 2022. The transaction will include participation from returning investor Beijing Relpow Technology Co., Ltd. After the completion of the transaction the registered capital of the company will increase from CNY 41 million to CNY 136 million. The transaction has been approved in the twenty-third meeting of the fifth board of directors and the twenty-first meeting of the fifth board of supervisors.