Zhi Yi Xiao
Director/Board Member at UNISEM (M)
Zhi Yi Xiao active positions
| Companies | Position | Start | End |
|---|---|---|---|
| UNISEM (M) | Director/Board Member | 2019-01-29 | - |
| TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Director/Board Member | 2019-05-20 | - |
Huatian Technology (Kunshan) Electronics Co. Ltd.
 Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Chief Executive Officer | 2012-12-31 | - |
Unisem Advanced Technologies Sdn. Bhd.
 Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Director/Board Member | - | - |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Director/Board Member | - | - |
Career history of Zhi Yi Xiao
Former positions of Zhi Yi Xiao
| Companies | Position | Start | End |
|---|---|---|---|
Xiamen Yonghong Group Co. Ltd.
 Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Corporate Officer/Principal | 2000-12-31 | 2008-12-31 |
Training of Zhi Yi Xiao
| Fudan University | Doctorate Degree |
| Adelphi University | Masters Business Admin |
Statistics
International
| China | 5 |
| Malaysia | 3 |
| United States | 3 |
Operational
| Director/Board Member | 4 |
| Doctorate Degree | 1 |
| Masters Business Admin | 1 |
Sectoral
| Electronic Technology | 7 |
| Consumer Services | 3 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Listed companies | 2 |
|---|---|
| UNISEM (M) | Electronic Technology |
| TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Electronic Technology |
| Private companies | 4 |
|---|---|
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Technology |
Xiamen Yonghong Group Co. Ltd.
Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Electronic Technology |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Electronic Technology |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
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