Vanguard International Semiconductor : 8/1, 2Q23 Presentation Material
August 01, 2023 at 01:52 am EDT
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VANGUARD
2023 Second Quarter Results
Investor Conference
August 1, 2023
Agenda
Welcome
2Q23 Consolidated Financial Results
Remark
Q & A
2Q23 Investor Conference - 2
Disclaimer
This presentation material contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.
2Q23 Investor Conference - 3
2Q23 Result Highlights
Amount : NT$ Million
2Q23
1Q23
2Q22
Amount
Amount
Amount
Net Revenue
9,854
8,187
15,301
Net Income
1,995
1,364
4,887
EPS (NT$)
1.21
0.82
2.94
Cash and Financial Instruments
33,058
33,927
39,586
Equity
41,367
46,613
37,909
Total Wafers Shipped (Kpcs)
511
414
773
2Q23 Investor Conference - 4
Statements of Comprehensive Income
Amount: NT$Million
Selected Items from
Statements of Comprehensive Income
Net Revenue
Cost of Revenue
Gross Profit
Operating Expenses
Operating Income
Net Non-operating Income Income before Income Tax Net Income
Diluted EPS (NT$)
2Q23
1Q23
2Q22
QoQ
YoY
Amount
%
Amount
%
Amount
%
%
%
9,854
100.0
8,187
100.0
15,301
100.0
20.4
(35.6)
(6,895)
(70.0)
(5,728)
(70.0)
(7,656)
(50.0)
20.4
(9.9)
2,959
30.0
2,459
30.0
7,645
50.0
20.4
(61.3)
(1,154)
(1,093)
(13.4)
(1,734)
(11.3)
5.5
(33.5)
(11.7)
1,806
18.3
1,365
16.7
5,912
38.6
32.3
(69.5)
402
4.1
335
4.1
197
1.3
20.2
103.9
2,208
22.4
1,700
20.8
6,109
39.9
29.9
(63.9)
1,995
20.2
1,364
16.7
4,887
31.9
46.3
(59.2)
1.21
0.82
2.94
47.6
(58.8)
2Q23 Investor Conference - 5
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VIS - Vanguard International Semiconductor Corporation published this content on 01 August 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 01 August 2023 05:51:10 UTC.
Vanguard International Semiconductor Corporation is a Taiwan-based integrated circuit (IC) foundry service provider. The Company provides wafer foundry services, including complementary metal-oxide semiconductor (CMOS), general logic ICs, high voltage ICs, mixed signal ICs, analog ICs, radio frequency (RF) ICs, ultra-low power CMOS ICs, bipolar-CMOS-double diffused metal-oxide semiconductor (DMOS) and CMOS image sensor processing services. It also provides multiple project wafer (MPW) services, mask services and design services. The Companyâs products and services are applied in the manufacture of computers and peripheral products, communication products and consumer electronics, such as liquid crystal display (LCD) monitors, mobile phones, local area network (LAN) devices, switches, handheld navigation products, digital televisions (TVs) and others.