Amica : Issue of bonds

The Management Board of 'Amica Spółka Akcyjna' with its registered office in Wronki, with reference to the contents of the Current Reports No. 35/2012 of 23 July 2012, No. 37/2012 of 27 July 2012 and No. 39/2012 of 02 August 2012, hereby announces that today (i.e. 16th May), they received confirmation that the Company has successfully carried out another issue of bonds of 'Amica Spółka Akcyjna' under the Medium- and Short-Term Bond Issue Programme.

[Purpose of the Bond Issue] The purpose of the issue was to reduce the costs and diversify the Company's funding sources. The bonds were offered to institutional investors in accordance with the appropriate regulations and legislation applicable in the Republic of Poland.

[Type of Bonds] The bonds are issued in Polish zlotys as uncollateralised, dematerialised and discounted bearer securities (as zero-coupon bonds).

[Volume of the bond issue] The bonds have been issued under the following terms of issue:

Issue with a value of PLN 7,000,000 (seven million PLN);

1. Date of issue: 16 July 2018;

2. Redemption date: 15 October 2018;

3. Yield to maturity - based on market terms

[The bonds will be redeemed at nominal value of the Bonds at the headquarters of the Issue Agent i.e. at the headquarters of mBank S.A.]

[The value of liabilities incurred as at the last day of the quarter preceding the issue of Bonds] The Issuer announces that the liabilities incurred by the Issuer as at 31 March 2018, according to the latest periodic report (report for the first quarter of 2018), amount to PLN 293,537 thousand. The prospective amount of the Issuer's liabilities by the date

Current Report No. 25/2018 - Bond issue

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of the total redemption of the Bonds issued should be assessed based on the statements and information provided in the manner and in accordance with the provisions of the MAR Regulation and the Act of 29 July 2005 on Public Offering and Conditions Governing the Introduction of Financial Instruments to Organized Trading and on Public Companies.