Shenzhen Danbond Technology Co., Ltd. is a China-based company, principally engaged in the research and development, manufacture and distribution of electronic components. The Company's products mainly include flexible printed circuit boards (FPCs), chip on film (COF) flexible packaging substrates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company distributes its products within domestic market and to overseas markets, with Japan as its major market.
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