UNIVERSAL ELECTRONIC

UEIC
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26.925USD +1.15%

Universal Electronics Unveils QuickSet at Las Vegas CES 20222

01/06/2022 | 01:54pm
Universal Electronics Inc. has unveiled its new family of QuickSet®-certified connectivity silicon products using Extreme Low-Power, energy-harvesting and high-performance technology, in Las Vegas on January 6, 2022 at CES® 2022. As the global leader in entertainment and smart home control technologies, UEI is committed to help transition the world towards a more sustainable future, by reducing primary battery waste throughout the life of the product, which in turn reduces the cumulative CO2 footprint. The new SOCs also offer significantly more processing power to deliver new features that enhance the overall user experience. Benefits of UEI’s Extreme Low-Power SOC platform: More compute: the processor architecture and memory optimization that delivers up to 2.5 times more processing power than current generation SOCs. This allows for more power-hungry features without compromising on battery life. More battery life: the SOC delivers up to 80% lower power consumption so that batteries can last up to 10 times longer, depending on remote architecture, due to adaptive scaling of supply voltage. Integrated energy harvesting: the SOC supports an integrated energy harvesting circuitry that recovers energy already present in consumer homes, such as natural and artificial lights, radio frequencies from wireless devices, and other energy sources. Superior power management: supports a wide range of energy storage and charging options with its highly configurable, ultra-efficient Power Management Unit (PMU) that enables true self-powering. At launch, UEI will offer two products in this silicon family - UE961 offers the full capabilities of the extreme low-power silicon with support for Bluetooth LE connectivity that is Bluetooth 5.2 compliant and UE962 which adds support for the built-in energy harvesting capabilities. In its next phase, UEI will launch a multi-protocol version with added 802.15.4.
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