Malaysian Pacific Industries Stock

Equities

MPI

MYL3867OO008

Semiconductors

End-of-day quote BURSA MALAYSIA 06:00:00 2024-04-18 pm EDT 5-day change 1st Jan Change
31.1 MYR +0.78% Intraday chart for Malaysian Pacific Industries -0.32% +10.28%
Sales 2024 * 2.1B 439M Sales 2025 * 2.37B 497M Capitalization 6.19B 1.29B
Net income 2024 * 132M 27.61M Net income 2025 * 239M 49.99M EV / Sales 2024 * 2.39 x
Net cash position 2024 * 1.17B 244M Net cash position 2025 * 1.43B 299M EV / Sales 2025 * 2 x
P/E ratio 2024 *
48 x
P/E ratio 2025 *
26.5 x
Employees 7,617
Yield 2024 *
1.05%
Yield 2025 *
1.11%
Free-Float 38.22%
More Fundamentals * Assessed data
Dynamic Chart
Malaysian Pacific Industries Berhad Announces Re-Designation of Jenifer Thien Bit Leong, Member of Nomination Committee as Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Chairman of Nomination Committee CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Director CI
Malaysian Pacific Industries Berhad Announces Resignation of Dato' Mohamad Kamarudin Bin Hassan as Independent and Non-Executive Member of Audit Committee CI
Malaysian Pacific Industries Berhad Reports Earnings Results for the Second Quarter and Six Months Ended December 31, 2023 CI
Chinese firms look to Malaysia for assembly of high-end chips, sources say RE
Malaysian Pacific Industries to Cease Manufacturing Operations of Unit MT
Malaysian Pacific Industries Berhad Announces the Resignation of Ir Dennis Ong Lee Khian as Independent and Non Executive Director CI
Malaysian Pacific Industries Berhad Announces the Appointment of Miss Jenifer Thien Bit Leong as Independent and Non Executive Member of Audit Committee CI
Malaysian Pacific Industries Berhad Announces the Re-Designation of Miss Foo Ai Li from Member of Audit Committee to Chairman of Audit Committee CI
Malaysian Pacific Industries Berhad Appoints Ir Dennis Ong Lee Khian as Independent and Non Executive Chairman of Audit Committee CI
Malaysian Pacific Industries' Profit Plunges in Fiscal Q1 MT
Malaysian Pacific Industries Berhad Reports Earnings Results for the First Quarter Ended September 30, 2023 CI
Malaysian Pacific Industries Berhad Announces Interim Single-Tier Dividend for the Year Ended June 30, 2024, Payable on December 19, 2023 CI
Malaysian Pacific Industries Berhad Announces Appointment of Jenifer Thien Bit Leong as Independent and Non Executive Member of Nomination Committee CI
More news
1 day+0.78%
1 week-0.32%
Current month+0.32%
1 month+5.71%
3 months+9.66%
6 months+15.19%
Current year+10.28%
More quotes
1 week
30.00
Extreme 30
31.32
1 month
29.40
Extreme 29.4
32.20
Current year
25.98
Extreme 25.98
32.20
1 year
25.16
Extreme 25.16
32.20
3 years
23.60
Extreme 23.6
51.50
5 years
7.39
Extreme 7.39
51.50
10 years
4.09
Extreme 4.09
51.50
More quotes
Managers TitleAgeSince
Chief Executive Officer 53 16-08-07
Director of Finance/CFO 48 23-09-30
Chairman 69 90-07-26
Members of the board TitleAgeSince
Chairman 69 90-07-26
Director/Board Member 48 21-08-31
Chief Executive Officer 53 16-08-07
More insiders
Date Price Change Volume
24-04-18 31.1 +0.78% 203 400
24-04-18 30.86 +0.13% 274,400
24-04-17 30.82 +0.06% 237,400
24-04-16 30.8 -0.65% 129,400
24-04-15 31 -1.21% 38,500

End-of-day quote BURSA MALAYSIA, April 18, 2024

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Malaysian Pacific Industries Berhad is an investment holding company. The principal activities engaged by its subsidiaries are that of manufacturing services of semiconductor packaging and testing, and manufacturing and sale of leadframes. The Company's segments are Asia, The United States of America (USA), and Europe. The Company offers a range of turnkey test services for radio frequency, mixed-signal, analog, digital and power devices. The Company’s subsidiaries include Carsem (M) Sdn Bhd, which offers full turnkey solutions for leaded and leadless semiconductor packaging and test services; Carsem Semiconductor (Suzhou) Co., Ltd, which is a provider of outsourced semiconductor packaging and testing in China, focusing on the MLPMicro Leadframes Package (QFN format), flip chip and ball grid array technology; Dynacraft Industries Sdn Bhd (DCI), which is a manufacturer of leadframes in the region; and Carter Resources Sdn Bhd.
More about the company
Trading Rating
Investor Rating
ESG Refinitiv
B-
More Ratings
Sell
Consensus
Buy
Mean consensus
HOLD
Number of Analysts
6
Last Close Price
31.1 MYR
Average target price
28.14 MYR
Spread / Average Target
-9.51%
Consensus