3DInCites Interviews Amkor’s Curtis Zwenger at the IMAPS International Symposium
November 08, 2021 at 11:48 am EST
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3DInCites' Françoise von Trapp wrapped up her conversations from the IMAPS International Symposium, with an extended episode! The questions she asked her guests were, "How have the events of the last 18 months impacted the future of the semiconductor industry" and "What are the three things we should be focusing on in advanced packaging right now?"
On this podcast you'll hear from Curtis Zwenger, Amkor Technology; E. Jan Vardaman, TechSearch International; Ram K. Trichur, Henkel; Robert Avila, Finetech; Jon Medernach, MRSI; Dhiraj Bora, Silitronics; and Craig North, GelPak.
Listen to additional podcasts from 3DInCites here https://www.3dincites.com/about-us/3d-incites-podcasts/
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Amkor Technology Inc. published this content on 07 November 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 08 November 2021 16:47:13 UTC.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.