YEH CHIANG TECHNOLOGY CORPORATION Yeh Chiang Technology Corporation Stock
Equities
6124
TW0006124001
Electrical Components & Equipment
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 36.65 TWD | +0.41% |
|
-2.79% | +16.53% |
| Sales 2022 | 2.09B 64.31M | Sales 2023 | 1.82B 56.01M | Capitalization | 5.74B 176M |
|---|---|---|---|---|---|
| Net income 2022 | 84M 2.58M | Net income 2023 | -85M -2.61M | EV / Sales 2022 | 2.13 x |
| Net cash position 2022 | 295M 9.06M | Net cash position 2023 | 248M 7.61M | EV / Sales 2023 | 3.01 x |
| P/E ratio 2022 |
56.6
x | P/E ratio 2023 |
-66.9
x | Employees | - |
| Yield 2022 * |
-
| Yield 2023 |
-
| Free-Float | 12.09% |
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* Assessed data
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| 1 day | +0.41% | ||
| 1 week | -2.79% | ||
| Current month | -0.81% | ||
| 1 month | -2.66% | ||
| 3 months | -6.51% | ||
| 6 months | +29.96% | ||
| Current year | +16.53% |
1 week
36.10
39.20
1 month
36.1040.50
Current year
30.8542.80
1 year
26.6053.30
3 years
21.9553.30
5 years
20.1553.90
10 years
18.3053.90
| Managers | Title | Age | Since |
|---|---|---|---|
Tai Kuang Wang
CEO | Chief Executive Officer | - | 05-07-14 |
Ya Chu Chiu
DFI | Director of Finance/CFO | - | 20-04-14 |
Shu Lung Chung
BRD | Director/Board Member | - | 05-07-14 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Shu Yuan Lin
BRD | Director/Board Member | - | 06-06-13 |
Min Ho Lee
PRN | Corporate Officer/Principal | - | 05-07-14 |
Chun Hua Chen
BRD | Director/Board Member | - | 05-07-14 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-04-22 | 36.65 | +0.41% | 302 845 |
| 24-04-22 | 36.5 | -1.75% | 400,541 |
| 24-04-19 | 37.15 | -3.76% | 288,538 |
| 24-04-18 | 38.6 | +1.58% | 333,217 |
| 24-04-17 | 38 | +3.26% | 234,450 |
End-of-day quote Taipei Exchange, April 22, 2024
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YEH-CHIANG TECHNOLOGY CORP. is a Taiwan-based company principally engaged in the manufacture and distribution of heat pipes. The Companyâs products consist of heat pipes, which are used in computer, communication and consumer electronic (3C) products for heat conduction; ball grid array (BGA) solder balls, which are used for packaging of integrated circuits (ICs); solder pastes, which are used for connectors and surface mounted technology (SMT) products, as well as light emitting diode (LED) modules and lighting fixtures. It also distributes raw materials. The Company distributes its products within domestic market and to overseas markets.
| 1st Jan change | Capi. | |
|---|---|---|
| +16.53% | 204M | |
| +2.69% | 44.49B | |
| +140.39% | 4.57B | |
| -0.02% | 2.88B | |
| -10.50% | 2.63B | |
| +77.47% | 1.06B | |
| -34.70% | 1.06B | |
| -5.47% | 1.04B | |
| +51.93% | 1B | |
| -27.11% | 866M |
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