Inactive Instrument

ThinFlex Corporation Stock

Equities

3144

TW0003144002

Semiconductors

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Managers TitleAgeSince
Chief Executive Officer - 16-12-13
Director of Finance/CFO - 10-05-10
Chief Tech/Sci/R&D Officer - 15-03-31
Members of the board TitleAgeSince
Chairman 66 09-01-20
Director/Board Member 81 09-12-03
Director/Board Member - 03-05-12
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ThinFlex Corporation is a Taiwan-based company principally engaged in the manufacture and distribution of flexible copper clad laminates (FCCLs) and related materials. The Company provides FCCLs, which are mainly applied in the manufacture of mobile phones, medical equipment, aerospace products, liquid crystal display (LCD) panels, cameras, printers, facsimile machines, photocopiers, computers, disk players, industrial equipment and scanners, among others, as well as coverlays, which are mainly applied in the manufacture of cameras, notebook computers, handheld computers, printers, scanners, and mobile phones, among others. It distributes its products in domestic market, and the rest of Asia and Europe markets.
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