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Hi-P International Limited Stock price

Equities

H17

SG1O83915098

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Hi P International : Delists from Singapore Bourse as Founder Completes Privatization MT
Hi-P International Limited(SGX:H17) dropped from S&P Global BMI Index CI
Hi P International : YHT Venture Closes Offer for Hi-P International Shares MT
Yao Hsiao Tung completed the acquisition of remaining 16.6% stake in Hi-P International Limited. CI
HI P International : COO for China Business Tenders Resignation MT
Hi-P International Limited Announces Executive Changes CI
Hi P International : YHT Venture Raises Hi-P International Stake to 87.89% MT
Hi P International : Singapore Index Falls on Friday; Hi-P International Jumps 11% MT
Hi P International : Zooms 11% on Delisting Offer from Chairman and Majority Shareholder MT
Yao Hsiao Tung made an unconditional offer to acquire remaining 16.6% stake in Hi-P International Limited for approximately SGD 270 million. CI
Hi-P International Limited Reports Earnings Results for the Half Year Ended June 30, 2020 CI
Hi-P International Limited Provides Group Earnings Guidance for the Second Half and Full Year 2020 CI
Hi-P International Limited Announces Re-Designation of Liu Hsiao-Tsu as Chief Operating Officer, Greater China Business Unit CI
Hi-P International Limited Announces Re-Designation of Jeffrey Tan as Chief Operating Officer, Overseas Business Unit CI
Hi-P International Limited Approves Final Tax-Exempt One-Tier Dividend, Payable on 1 July 2020 CI
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Managers TitleAgeSince
Chief Executive Officer 83 79-12-31
Director of Finance/CFO - 06-06-25
Chief Administrative Officer - 84-12-31
Members of the board TitleAgeSince
Chief Executive Officer 83 79-12-31
Chief Administrative Officer - 84-12-31
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Hi-P International Limited is an integrated contract manufacturer. The Company is engaged in the design and fabrication of mold (MDF), precision plastic injection molding (PPIM), assembly and provision of ancillary services (surface finishing services). Its segments include Precision plastic injection molding; Mold design and fabrication, Assembly, which is engaged in the provision of sub-product assembly and full-product assembly services. It provides solutions to customers in industries, such as telecommunications, consumer electronics, computing and peripherals, lifestyle, medical and industrial devices from design, electro-mechanical parts, modules to product manufacturing services. It has approximately 10 manufacturing plants located in over six locations in the People's Republic of China (Shanghai, Chengdu, Tianjin, Xiamen, Suzhou and Nantong), Poland, Singapore and Thailand. It has marketing and engineering support centers in China, Singapore, Taiwan and the United States.
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